Development of a laser driver for driving diode lasers

With the development of science and technology, semiconductor laser technology has penetrate every field of national economy and defense construction. It has been applied in remote communication, laser radar, digital signal storage and recovery, laser ranging, robot, holographic application, medical diagnosis, etc. However, It’s very demanding for semiconductor laser on its working conditions. If It’s under improper work or storage condition, it will result in a sharp deterioration in performance and even failure. Therefore, an electronic power supply for driving diode lasers, i.e. laser driver is playing a more and more important role in making the laser work normally.

In recent years, the laser has been used in wider and wider applications, so the development of the driving power supply with high quality is imperative. Besides regular functions, the new power supply should have more stable output current and more reliable and effective protection for the laser.

The physical photo of a laser driver for driving diode lasers

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The main performance parameters of laser driver

A laser driver is between multiplexer and laser, which completes electro-optical conversion function. In order to make the laser work well, the good driving signal needs to be provided, depending on the performance parameters of laser driver.

The physical photo of laser driver

The performance parameters of laser driver mainly include:
(1)Working speed: the working speed of laser driver can be reflected by system bandwidth and the upper limit of working speed can increase with the bandwidth increase.
(2)Output voltage swing: the output modulation voltage has enough swing.
(3)Shake: small shake can reduce bit error rate and improve the performances of driving circuit.
(4)Power consumption: driving circuit usually has larger power consumption than other transmission modules have. The heat generated by chip can be reduced by declining the chip power consumption, so the requirements of chip package can also be reduced. Therefore, chip can work more stably and reliably.
(5)Input and output impedance: the impedance 50Ω is usually selected.
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Driving modes of laser driver

The main function of laser driver is to enlarge high speed signal outputted by a multiplexer to drive the laser diode to work effectively.

Figure 1.The modulation modes of laser driver

Subsequent circuit of laser driver is light emitting device and there are two driving modes to drive it, as shown in the figure 1. One is directly working on laser diode. The main principle is to change the input current of laser diode and then the required optical digital signal is generated, which is called direct modulation. The generation and modulation of light wave are both completed in this method. It is easy to implement this driving mode and this node has simple equipment, low cost and wide bandwidth, etc.

The other diving mode is indirect modulation. Generally speaking, by using electro-optic crystal modulator, modulation in the external light source can be realized and the continuous wave of laser driver is modulated by transmission digital signal in the electro-optic crystal modulator. The advantage of external modulation is that it can reduce Chirp effect that is the maximum factor to block bit rate increase, so as to obtain higher bit rate and further transmission distance.

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Function of laser driver

In optical fiber communication, optical module plays a very important role. Laser driverused on the front end of optical emission can realize the laser bias and modulation. High speed voltage signal is converted into high speed current signal to modulate laser.

Actually, a laser driver is a kind of high speed switching current and its circuits mainly include:(1) high speed modulation circuit; (2) high speed bias current driving circuit; (3) automatic power control circuit.

Our company specializes in researching and producing laser drivers. In order to meet customers’ different design demands, we have designed multiple types of laser drivers, such as high voltage constant current laser driver, low noise constant current laser driver, dual mode laser driver, AC input high current high efficiency, and so on. These laser drivers don’t need heat sink because of their high efficiency.

The physical photo of laser driver

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The simple classification of thermoelectric coolers

Thermoelectric cooler (TEC) is built on the thermoelectric system, which can both cool and heat, depending on DC current direction. As TEC has no refrigerant, no pollution, no rotation parts, no noise, long service lifetime and some other advantages, it has been widely used in electronic fields, laser fields and so on.

The physical photos of TEC

According to temperature, TECs can be divided into two types, regular temperature rectangular TEC and high temperature rectangular TEC. The temperature range of the former is −60°C~85°C and the latter is −60°C~200°C.

According to package form, there are sealed version and non-sealed version. The service lifetime of sealed TEC is longer than that of non-sealed TEC, but the former has lower efficiency. If TEC works in a moisture environment, the sealed TEC should be selected to achieve long service lifetime and high reliability.

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Development prospect of thermoelectric cooler

With the development of science and technology, there are more and more researches about thermoelectric cooler (TEC) and the achievements on the improvement of the material optimal value and the optimization of thermoelectric cooler has been obtained. Now TEC has been widely used in many fields, and along with the time and research development, TEC will play more and more important role in the electronic  and  some other fields.

（1）Theoretical study of TEC technology is mature. Low optimal value coefficient indicates that it has great development space in theory. With the further research and development of new materials, the optimal value will continuously improve and TEC will have broad prospects.

（2）More experiments in production technology and process should be done. The organic combination of computer aided design has a great help for reducing the test cost, accelerating the improvement of theory and improving the performance of the semiconductor.

（3）In application, different research methods are used in different fields. As the operation process of TEC is influenced by many factors, it is best to use the methods of system analysis and comprehensive analysis.

It can be seen from above that TEC will have good development prospect in the future.
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The current main problems of thermoelectric coolers

Thermoelectric cooler (TEC) is built based on Peltier effect. It is a kind of solid components, which has no pollution, high reliability, small size, rapid cooling, rapid heating and some other characteristics. It has been widely used in electronic, medicine, industry, agriculture and some other fields. However, TEC still has some problems.
1.In order to reach the equivalent cooling efficiency of mechanical compression refrigeration, the material optimal coefficient of TEC is not high, which is the main factor that hinders the development of TEC.

2.There is little research about optimization design of cooling system on cold and hot sides, so it makes the design of TEC in the theoretical calculation stage and the actual operation effect cannot be well guaranteed.

3.With the rapid development of science and technology, the sizes of devices are becoming more and more complex and there are more and more factors needing to be considered. How to solve optimization problems of multi-stage TEC, dissipation problems of small size devices and thermoelectric energy conversion problems are the content of the future research.

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Dissipation methods on TEC hot-side

During the cooling process of thermoelectric cooler (TEC), the dissipating effect has direct effect on the cooling performance. The bad performance of heat transfer will cause the temperature rise on hot-side, thus the cooling capacity will reduce a lot.

Under certain current, heat transfer from hot side to cold side can be reduced with the decrease of temperature. Only when the heat on the hot-side is drained away in time to maintain different hot-side temperature, the cold side can continuously cool.

At present, there are many researches on dissipation methods on TEC hot-side. The main dissipation methods include air natural convection, air forced convection cooling, water cooling, heat pipe heat transfer, etc.

1.Air natural convention
Using air national convention, the heat can be dissipated into environment. Because of small power, this method can be used in some small occasions or some occasions with noise restrictions.

2.Air forced convection cooling
Based on natural convection cooling, an axial flow fan is fixed on the end of heat sink.

3.Water cooling
A cold water tank is connected to the hot end of TEC. The water through the cooling water pipe can take the hot-side heat away. This is a very high efficiency cooling method.

4.Heat pipe heat transfer
When comparing with troditional method, in working process, the temperatures on the both sides have little difference on both ends. A long isotherm ribbon comes in to being along with the axis of the heat pipe.

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The advantages of thermoelectric generator

Thermoelectric generator (TEG) is built based on Seebeck effect to convert heat directly into electricity. In the open circuit composed with two different conductors, if there is temperature difference on the two contact points of the conductor, electromotive force will come into being in this open circuit. The polarity of the output voltage depends on the polarity of the temperature difference on both ends of the TEG. If the hot end and the cold end of TEG are swapped over, the polarity of the output voltage will change.

The photo of TEG

When comparing with mechanical thermoelectric generator with DC power supply, TEG has obvious advantages.

1.There are no shelf life restrictions and no need of maintenance, so it has long service lifetime.

2.As thermopile operates stably, the supplied voltage is stable and there is no short circuit phenomenon.

3.Because of no rotation parts, this TEG is completely silent and extremely reliable.

The power of TEG is from 4.5w to 12w, which can be made into a table lamp or mobile boiler. What’s more, it has been widely used for lighting, battery charge and some other applications needing DC power supply..

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ON/OFF Cycle Test for TEC modules

The MTBF for standard TECs is at least 200,000 hrs, which is based on relatively stable running conditions, with several times ON/OFF per day during operation. However, in other applications, the power is frequently on/off, especially in constant temperature controller application. There is a test for research the influence of the on/off switch cycle to the TECs in a constant temperature. Install the TEC module with silicon grease between a couple of convector radiators. The load time of the current is 7.5s, and the breaking time is 7.5s, thus a cycle is 15s. During the cycle, monitor the input current of each TEC module. The mark for failure is that the resistance of TECs increases, resulting in the current decreases. The test takes about 25,000 hrs with at least 6 millions of cycles. Under this condition, the MTBF is 125,000 hrs, or 3*107 times of on/off switch cycle.

Most caloristat has a higher switch temperature difference, which can form an obvious thermal cycling. The temperature of TEC module will change between high  and low temperature. Thermal cycling will definitely shorten the life span of TEC modules, therefore, it’s not recommended to use traditional on/off switch constant temperature control system in the applications requiring high stability.

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Combined influence of TEC performance

Thermoelectric cooler (TEC) is also called semiconductor cooler, which is using an artificial cooling technology based on Peltier effect. At present, the focus of domestic and foreign researches is on the characteristic optimization of TEC itself thermoelectric materials, but there are few researches on the combined influence of TEC performance. The main integrated influence factors of TEC internal structure include geometry size of the thermoelectric arm, contact effect and so on.

(1)   After determining the working condition and materials, the cooling capacity is depending on G factor (G is dimension evaluation factor of thermoelectric unit), which has an optimum value that can make the cooling capacity achieve the optimum value. The value of G factor is recommended between 20K ~ 30K in order to obtain the significant cooling effect.

(2)   After comprehensive consideration of the limitations of heat conduction temperature and diversion contact resistance, the recommended length range of thermoelectric arm is between 2mm~ 5mm and the temperature difference design of the hot and cold end within that range is the best, which can achieve higher cooling efficiency and ideal heat conduction effect.

(3)   When the system is running in a low operating working current, enhancing the cooling strength of the cold side can improve the economic efficiency. When the system is stably running around the best working condition area, improving the dissipation strength of the hot side can further improve the cooling performance of the system.

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General principles for selecting the thermoelectric cooler (Ⅱ)

Continued from the last article.

5. Determining TEC series
Selecting TEC series must meet the actual temperature difference requirements, that is, the nominal temperature difference shall be higher than the actual temperature difference, so that it can meet the requirements. However, the series is not too much because TEC price has great improvement with the increase of series.

6. Determining the specifications of TEC
After selecting the series of TEC, its specifications can be determined, especially working current. Because of different working current, the TEC with smallest working current is commonly selected. In this way, the cost of the assorted power supply is small.

7. Determining the quantity of TEC
The quantity is determined by total cooling power produced by TEC that has met the requirement of temperature. Make sure the total cooling capacity of TEC is larger than the total power of heat load at working temperature. The thermal inertia of TEC is very small, so when there is no load, it will take less than 1 minute. However, because of large load inertia, it will take far more than 1 minute even for a few hours before reaching the set temperature. The faster the working speed is, the large the quantity of TEC is.

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General principles for selecting the thermoelectric cooler (I)

Thermoelectric cooler (TEC) plays an important role in its application products. According to the characteristics, weakness and application range, the following problems should be determined when selecting TEC.

1.Determining TEC working state
The size and direction of working current can determine the cooling, heating and constant temperature performance. Although cooling mode is most commonly used, cooling and constant temperature performance cannot be ignored.

2.Determining the actual temperature of hot side when cooling
As TEC is a temperature component, it needs to be mounted on a good heat sink in order to achieve the best cooling effect. The condition of heat sink can determine the actual temperature on hot side. It is noteworthy that because of temperature gradient effect, the actual temperature on TEC hot side is always higher than that on the surface of heat sink. Similarly, there also exits temperature gradient between cooling space and the cold side of TEC.

3.DeterminingTEC working environment
According to working environment, the thermal insulation measures can be determined.

4.Determining working subject and heat load of TEC
Besides temperature effect on the hot side, the minimum temperature or maximum temperature difference that TEC can be up to is determined under condition of no-load and heat insulation. In actual work, TEC cannot achieve real heat insulation and heat load must exist, otherwise there is meaningless.

The left will be introduced in the next article.
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The Reliability of Thermoelectric Coolers in Thermal Cycling Process (II)

High reliability and long life time can be achieved when the thermal cycling times is few, the temperature change range is narrow, upper temperature limit is low, as well as that temperature change is slow. On the contrary, in a wide temperature range, high changing speed, many times cycling, it will shorten the life time of TECs largely. It’s noteworthy that the absolute life time of TECs depends largely on the total cycling times, not the total time for the cycling.

Different TECs will largely influence failure rate in thermal cycling. TECs with high max. operating temperature have a longer service life than those with low max. operating temperature. This applies to the condition that max. temperature in thermal cycling is far lower than the max. temperature of the TECs. Moreover, there are two factors influencing MTBF in thermal cycling. Small size TEC has fewer thermocouples, which has longer life time than large size one. For large size TEC, heat-mechanical stress is larger and it has more thermocouples, which will increase the possibility of failure under this heat stress. Thus, small size TEC has higher stability than large TECs. There is an actual application. Heat-mechanical stress is produced in TECs. At this time, thermal cycling can be seen as an effective screening technology. Defective TECs can be screened out when TECs are placed in an accurate control cycling. This operation may increase the cost, but it’s necessary when high stability is needed.

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The Reliability of Thermoelectric Coolers in Thermal Cycling Process (I)

It can be seen as the reliability test for TECs to make continuous thermal cycling to TECs in a wide temperature rang. Especially temperature of TECs in this process rises to very high. Compared with most applications, this process will cause higher failure rate. Most of failures are rooted in unmatched thermal expansion coefficients of thermal materials and other components. This is inevitable. It performs as initial failure, but sometimes, performance degeneration will be observed before failure.

In order to research the influence of thermal cycling to TECs, we need to define thermal cycling first. In most applications, many thermoelectric components are suffering periodic temperature rise and fall, which may be in a wide temperature range. Although the boundary between cycling and non cycling working conditions is not obvious, but in general, we define thermal cycling as a working condition, under which temperature rises and falls continuously and regularly in a very long time. This condition generally refers to auto temperature control or mechanical temperature control, not manually control. If there are only several cycles of temperature rise and fall, we don’t call it thermal cycling.
The failure rate in thermal cycling is related at least four factors: 1. The total cycling times; 2. The total temperature change range in thermal cycling; 3. The upper temperature limit; 4. The speed rate of temperature change.
To be continued…

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Operating instructions of thermoelectric coolers

Thermoelectric coolers (TECs) are built based on Peltier effect, which can both heat and cool depending on the direction of input DC current. Because of having no noise, no vibration, no refrigerant, light weight, compact size and some other advantages, TEC has been widely used for cooling certain components in electronic devices and radio communication equipment.
There are some operating instructions that you should know before using TEC.

Correct installation and usage

1.One side of TEC is mounted on heat sink, and the other side is mounted on cool conduction system. The flatness of mounting surface is less than 0.03mm, and burr and dirt should be removed.

2. In order to have good contact, the contact surface of TEC and heat and cold conduction blocks should be coated with a thin layer of thermal grease.

3. When fixing TEC, make sure TEC bears uniform stress.

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Temperature controller based on thermoelectric cooler

Thermoelectric cooler (TEC) is based on “Peltier effect”, which can both cool and heat. According to changing the polarity of direct current, the same TEC can realize cooling or heating. This effect is achieved by the principle of thermoelectric. In principle, TEC just plays a role of a heat transfer tool.

Physical picture of TEC

There are advantages as follows:

1.There is no need of any refrigerant and it can work continuously.

2.TEC has two functions, cooling and heating. In general, the cooling efficiency is not very high, but the heating efficiency is very high, which is always greater than one. Therefore, only one piece of TEC can replace of discrete heating system and cooling system.

3.By controlling the input current, temperature control with high precision can be realized and because of temperature detection and temperature means, it is easy to form automatic control system.

4.Thermal inertia of TEC is very small, and the time of heating and cooling is quite short. In the condition of good dissipation on the hot side and on-load on the cold side, the time of powering is less than one minute, and TEC can reach the maximum temperature difference.

5.TEC has a wide temperature range, from 90℃ to -130℃

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The Reliability of Thermoelectric Coolers (II)

In the installation process, it’s necessary to avoid wrong installation, which makes influence to the TEC modules. There are the following points that may affect the reliability of the TEC modules during the installation:

a) TECs have high mechanical strength under pressure, but they have a small shear strength. Accordingly, TECs cannot be placed in a mechanical system that plays a main supporting role. Moreover, in the applications that may involves shocking and impact, it’s better to install the TECs under proper pressure, i.e. clamp them by screws. For peltier modules, they can cope with shocking or impact environment in airplane, military or similar environment by proper installation method.

b) Although the maximum suggested pressure for TECs is 15kg/cm2 (200 pounds/square inch), most of TECs can bear a pressure over 15kg/cm2 (200 pounds/square inch) and work well in the test. The most important is that the installation method is by using screws to fix the TECs and proper pressure has been kept during installation, which prevent TECs flexible and moving by a small lateral force. If there are multiple thermocouples in a TEC, moving parts will bring much trouble. Under this situation, if the pressure of the chucking is not enough during installation, then it may cause poor performance of TEC cooling or TEC failure ahead of time. When installing multiple stages TECs in array, it’s recommended to use TECs with a height tolerance of ±0.025 mm. Under any situations, make sure even pressure is added by the chucking and the surface shall be flat.

To be continued…

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Laser drivers

In the system of optical communication, laser driver is an important part of an optical transmitter and it provides enough current to drive laser diode with direct modulation or enough voltage to drive electoral absorption device with indirect modulation.

In order to meet different demands of design, our company has developed a variety of series of laser drivers and laser controllers: ultra-low noise laser controllers, high efficient laser controllers, high efficient laser drivers, dual channel mode laser controllers and high power AC laser driving power supply. The series of ultra-low laser controllers and drivers have relatively small current, such as 100 mA, 200mA, 250 mA, 1 A and so on. The current of the series of high efficient controller and driver can be up to 1A，2A，3A，4A，6A or 10A that is in the research and development. The dual channel mode can drive N type or P type diode laser relatively. High power AC laser driving power supply can output 20~45A current and there are many kinds of output voltages 3.5V, 5V, 6V and so on that can be used.

Here, ATLS1A102 will be introduced, as shown in the following picture.

Features

1. Output current can be modulated

2. Noise of output current: <10μA

3. Range of input voltage: 4.5V~5.5V

4. Operating environment temperature: -25℃~85℃

5. Modulation bandwidth:100KHz

6. Fully shielding electromagnetic interference

7. Two package forms: DIP and SMT

8. Compact size:20*14.5mm

9. Overcurrent protection device

10. 100 % Lead (Pb)-free and RoHS compliant

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The Reliability of Thermoelectric Coolers (III)

c) In order to avoid TECs losing effect due to obvious mechanical vibration, do not place any large mass device without support on the cold end of TECs. When involving lass mass device, it’s better to use chucking to fix the TECs between heat sinks and the object. Or place the device on a cold plate that can be media at first. At this time, damping screws can effectively increase the shear strength of the whole mechanical system.

d) The TECs shall insulate from moisture in the air in order to avoid reduction in its performance or electrochemical corrosion to the TECs. When the temperature reaches below dew points, effective sealing protection shall be installed in order to prevent moisture entering into TECs. The protection layer shall be installed around TECs between heat sink and the object. Electron level RTV silica gel can be directly used as the protection layer of the TECs.

e) If the working conditions of TECs is involved in thermal cycle or large temperature change, soldering or epoxy resin installation methods are not recommended. That’s because rigid connection is needed in these two methods, which will cause large thermal stress, resulting in TECs losing effect ahead of time, unless thermal expansion coefficient of all the components are very close. At this situation, it’s recommend to use installation materials like thermal conductive silicone, graphite flake, etc.

Moreover, temperature control method will affect the reliability of TECs. It’s suggested to use linear or equal proportion temperature control method, not  ON/OFF.

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Laser drivers- power supply for lasers

With the development of science and technology, laser technology has been used in many fields, such as national economy, national defense construction and so on. And it has wide applications in long-distance communications, digital signal storage and recovery, laser ranging, robotics, holographic application, medical diagnosis, etc.

Picture ofthe laser driver

However, laser has strict requirements for working conditions, that is, under the conditions of inappropriate work or storage, the performance will be deteriorated or even be damaged. Therefore, the power supply of  laser driver  plays a significant role in making laser work normally.

In recent years, the applications of laser become wider and wider, and the development of lasers has the pressing demands for a power supply for driving lasers with high quality. New type driving power supplies not only have the function of drivers, but also can make input current more stable, which can protect lasers more reliably and availably. Microcontroller can be used to do program control for the power supply of laser driver, which can make the whole machine operation simple and also improve the degree of automation of the whole machine. At the same time, it can also provide favorable conditions for the performance improvement and expansion of the power supply.

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Drive circuit of laser

 Laser is a kind of light source components. In actually, drive circuit  refers to modulation circuit of light source device, which plays a role of converting digital signal to optical pulse signal and then sending to fibers. This part is the core of optical transmitter, which decides many important technical parameters.

As shown in figure 1, the main function of laser drive circuit is to provide appropriate bias and modulation current for laser diodes, which can make laser work normally. Thereinto, the bias current is constant and it can make laser diodes always work in linear region above the threshold current; the modulated current is constantly changing and with the change of the input voltage waveform, it can do the synchronous switch operation. The threshold current and the slope efficiency of semiconductor laser are closely related to its structure, fabrication process, manufacturing materials and working temperature. Ideally, laser bias current should change with the threshold current in the same direction. The modulation current will reversely change with the change of slope efficiency.

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The miniaturization of thermoelectric cooler (TEC)

Based on the Piltier effect, thermoelectric cooling is an energy conversion process, using electric energy as power, that is: when the direct current is through two different conductive materials, nodes will have endothermic phenomenon (when the current is in the opposite direction, exothermic phenomenon will be generated). As the Peltier effect of semiconductor materials is very obvious, the thermoelectric modules are mostly made up of semiconductor materials at home and aboard.

In the practical application, thermoelectric cooling is generally made up of only one element (i.e. TEC), which is suitable for dot cold. With the continuous development of electronic device miniaturization, structureintegration and function diversification, thermoelectric cooling will become the mainstream technology of cooling electronic components. Therefore, the TEC miniaturization is the direction of development. What’s more, due to the lightweight requirements of the aerospace application, the slim and large thermoelectric cooling film is the another development direction. In order to solve the heat dissipation problems generated by device miniaturization of aerospace vehicles, nanotechnology will be used to develop TECs, which ensure thermoelectric materials of TEC can meet the requirements of high conductivity and low thermal conductivity. Maybe nanotechnology can restrain thermal conductivity obviously and at the same time, electron transfer capability cannot be reduced. Additionally, it can also effectively improve the contact thermal conduction between TEC and other devices.

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Charaeristics of a glass encapsulated thermistor

A glass encapsulated thermistor mainly plays a role of temperature compensation. There are some kinds of packaging materials, such as epoxy resin, SMD, glass and so on. The glass encapsulative has high temperature resistance and moisture resistance. However, comparing with some other packaging forms, its responding speed is a little slow, around ten senconds.
Application range

1. Temperature control and detection forhousehold appliances, such as air conditionor, microwave oven, electric fan and so on.

2. Temperature detection and consumption for office automation equipments, such as printer and copier.

3. Temperature control and detection for industry, medical care, meteorology and so on.

4. Page indicator and flow measurement

5. Phone battery, electronic thermometer, medical equipment, etc.

Main features

1. High resistance accuracy

2. High stability andreliability

3. Wide resistance range: 1～1000KΩ

4. Light weight, small size and simple structure

5. Fast thermal sensing speed and high sensitivity

6. Wide working temperature range: -55 C to 250 C

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