Thermoelectric cooler (TEC) is also called semiconductor cooler, which is using an artificial cooling technology based on Peltier effect. At present, the focus of domestic and foreign researches is on the characteristic optimization of TEC itself thermoelectric materials, but there are few researches on the combined influence of TEC performance. The main integrated influence factors of TEC internal structure include geometry size of the thermoelectric arm, contact effect and so on.
(1) After determining the working condition and materials, the cooling capacity is depending on G factor (G is dimension evaluation factor of thermoelectric unit), which has an optimum value that can make the cooling capacity achieve the optimum value. The value of G factor is recommended between 20K ~ 30K in order to obtain the significant cooling effect.
(2) After comprehensive consideration of the limitations of heat conduction temperature and diversion contact resistance, the recommended length range of thermoelectric arm is between 2mm~ 5mm and the temperature difference design of the hot and cold end within that range is the best, which can achieve higher cooling efficiency and ideal heat conduction effect.
(3) When the system is running in a low operating working current, enhancing the cooling strength of the cold side can improve the economic efficiency. When the system is stably running around the best working condition area, improving the dissipation strength of the hot side can further improve the cooling performance of the system.
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