The miniaturization of thermoelectric cooler (TEC)

Based on the Piltier effect, thermoelectric cooling is an energy conversion process, using electric energy as power, that is: when the direct current is through two different conductive materials, nodes will have endothermic phenomenon (when the current is in the opposite direction, exothermic phenomenon will be generated). As the Peltier effect of semiconductor materials is very obvious, the thermoelectric modules are mostly made up of semiconductor materials at home and aboard.

In the practical application, thermoelectric cooling is generally made up of only one element (i.e. TEC), which is suitable for dot cold. With the continuous development of electronic device miniaturization, structureintegration and function diversification, thermoelectric cooling will become the mainstream technology of cooling electronic components. Therefore, the TEC miniaturization is the direction of development. What’s more, due to the lightweight requirements of the aerospace application, the slim and large thermoelectric cooling film is the another development direction. In order to solve the heat dissipation problems generated by device miniaturization of aerospace vehicles, nanotechnology will be used to develop TECs, which ensure thermoelectric materials of TEC can meet the requirements of high conductivity and low thermal conductivity. Maybe nanotechnology can restrain thermal conductivity obviously and at the same time, electron transfer capability cannot be reduced. Additionally, it can also effectively improve the contact thermal conduction between TEC and other devices.

If you have any questions and suggestions about TECs, please feel free to contact us. We will be very happy to receive your feedback.
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